Communication Encapsulation Tube
Features:
- Good sealing
- Excellent thermal shock resistance
- High light transmittance
- Material: 3.3 high boron silicon glass
Specification:
|
Mean coefficient of linear expansion α 20/300 acc. To ISO3585 |
3.3·10-6 K-1 |
|
Transformation temperature |
525℃ |
|
1013 upper annealing point |
560℃ |
|
107.6 softening point |
825℃ |
|
104 working point |
1260℃ |
|
Maximum short-time working temperature |
500℃ |
|
Density ρ |
2.23gcm-3 |
|
Modulus of elasticity E |
64·103N·mm-2 |
|
Poisson’s ratio μ |
0.20 |
|
Thermal conductivity λ w at90℃ |
1.2W·m-1K-1 |
|
Temperature for the specific electrical resistance of 108 Ω·cm (DIN52326) tk 100 |
/250℃ |
|
Logarithm of the electric volume resistance ( Ω·cm) |
|
|
at 250℃ |
8 |
|
at 350℃ |
6.5 |
|
Dielectric properties (1MHz,25℃) |
|
|
Dielectric figure |
4.6 |
|
Dielectric loss factor tan σ |
37-10-4 |
|
Refractive index ( λ=587.6nm) |
1.473 |
|
Stress-optical constant (DIN 52314)k |
4.0·10-6mm2·N-1 |
Drawing
Order Guide
